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Purchase From

We pursue 100% quality inspection and 100% customer satisfaction.

Original manufacturer

The goods from original manufacturer with quality assurance.

Authorized distributor

The goods from authorized distributor with quality assurance.

Factory

Most of the goods come from factories with guaranteed quality. We will conduct strict quality verification and control on materials that have been unpacked in old years.

Other resources

All incoming materials from other resources require strict industry quality verification testing to ensure quality assurance.
Quality Process
Implementing strict quality management processes is the foundation of quality assurance. The chip products we purchase all in strict quality process control and implemented in all aspects, from channel selection and filtering to incoming material testing, risk filtering, shipment packaging, logistics and transportation. This can ensure that we provide every customer with high-quality and reliable products.
Supplier
level
IQC appearance
inspection
Laboratory in
depth inspection
Filter
quality risk
Quality
qualification
Qualified
Warehousing
Quality Detection
We implement strict industry standards such as AS6081 for chip quality inspection, and our professional quality inspection team and quality management system ensure the authenticity of all tested and inspected parts. This ensures that we provide high-quality, reliable and safe chips to every one of our customers.

Appearance detection

Check the outer packaging to determine whether it is refurbished or original.

Electrical test

Use semiconductor test instruments to detect chip defects or damage through static, open, and short circuit parameter conditions.

Weldability test

Test whether the chip meets the standard by simulating the soldering amount of pins.

Ambient temperature test

Environmental temperature testing, simulation of various extreme environments have a lot of impact on products

De-cap test

Capping (unsealing) is mainly the use of instruments to corrode the package on the surface of the chip, check whether there is a wafer inside.

Ultrasonic scanning

Ultrasonic pulses are used to detect the presence of voids/delamination/cracks inside the sample.

Failure analysis

Through analysis to determine the failure mechanism, find out the failure causes, feedback to the design, manufacturing and use.

X-ray test

When X-Ray is used to penetrate different density materials, its light intensity changes differently, and the resulting contrast effect can form an image

Label checking

original or not by checking charactor, editing, etc.

Pass the test

After detailed inspection, it can be put into storage.

Visual inspection

Checking mark, pin, and braid to judge if renovated or original goods.

Function test

Power on test on EVM board to test the function if meet the spec.

Weldability test

test whether the tin loading capacity of the chip pin is up to the standard by simulating the tin eating capacity of the pin.

Function test

Power on test on EVM board to test the function if meet the spec.

X-ray test

A non-destructive test to detect the internal structure and lead imaging.

De-cap test

A destructive test to use laser etching and chemical reagent etching to remove the packaging shell so as to better observe the structure.